[11/17/09]
KSW Microtec will show its latest product innovations for the contactless card industry at Cartes&ID from November 17th to 19th.
Among the displayed KSW products will be the new generation of thinnest RFID prelaminates for eGovernment, ePayment and High Security applications. eID cards require those to enable the implementation of a variety of additionally needed card layers for security features and not to exceed the allowed card thickness.
The prelaminates of the Thinlam family are extremely thin and enable the manufacturing of HF and UHF RFID cards with multiple layers, due to the thickness down to 200?m. As the Thinlams are manufactured without chip modules, they ensure an exceptionally plane card surface without sink marks. Furthermore the prelaminates maintain the highest durability thanks to the patented chip connection technology, achieving tighter resonance frequency tolerances. Thinlam is available in polycarbonate, PVC, PET or Teslin and can also be used for transparent RFID cards due to the excellent optical appearance.
An ideal security and tracking solution is offered by the KSW WindSpeed family. KSWs windshield inlays, with a read range of approximately 18 feet, offer more accurate, efficient and secure vehicle access for commercial fleet operators as well as for private vehicle owners who require secure access and safer parking.
The inlays also allow safe access to parking areas, secured business and industrial parks as well as gated communities. The WindSpeed family can also be used for toll stations and to control entry and exit gates to automotive services such as car rental parks or car washes.
Another highlight is the presentation of Henrik Warmbier, Product Manager at KSW Microtec, on the topic ?Mobile Phone Sticker- A Bridge to NFC at Cartes conference on November 19th. Today NFC is a well discussed topic in the RFID market.
Visit KSW Microtec at Cartes 2009, on booth 3E072- the same position as 2008.
KSW Microtec AG, with its headquarters in Germany, is the world?s leading supplier of RFID (Radio Frequency Identification) components for applications such as eTicketing, ePayment, Asset Management, Access Control and High Security. KSW combines successful high-end wafer processing, extremely efficient assembly technology and far-reaching expertise in design. KSW has earned itself a leading position on the market as one of the most efficient, and simultaneously most flexible, producers of RFID components. The globally active company was founded in 1994 and has clean room production facilities in Germany. KSW is an investment holding of the listed venture capital company Deutsche Effecten- und Wechsel-Beteiligungsgesellschaft AG headquartered in Jena. For more information see: www.ksw-microtec.de
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